SHEET FOR BONDING ELECTRONIC COMPONENT, METHOD FOR MOUNTING ELECTRONIC COMPONENT, AND EQUIPMENT FOR MOUNTING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a sheet for bonding an electronic component, a method for mounting the electronic component, and equipment for mounting the same by which electronic component can be mounted with high density and productivity at a low cost. SOLUTION: A sheet 101 for bonding the electronic component is provided with a detection window 110 which is formed corresponding with recognition patterns 123 and 124 that are formed on a circuit forming body 120 or an electronic component 125 and used for alignment when loading the electronic component 125 on the circuit forming body 120, and which exposes the recognition patterns when placing them on the circuit forming body or electronic component and allows the recognition pattern to be picked up. Therefore, the recognition pattern can be picked up through the detection window, so that an alignment accuracy between the circuit forming body and electronic component can be improved and the electronic component can be also mounted in high density, permitting the improvement of productivity and reduction of cost.