发明名称 METHOD FOR MANUFACTURING MULTI-LAYER BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a flat multi-layer board easily. SOLUTION: The method for manufacturing a flat multi-layer board includes: a first step of forming a laminated body 12 containing ceramic powder and glass powder and an electric wiring 1 formed therein; a second step of forming layers 13a and 13b containing inorganic powder and resin on one main plane 12a and the other main planes 12b of the laminated body 12; and a third step of burning the laminated body 12 having the layers 13a and 13b to form a base body 14 made of a dielectric body of a sintered body. The layers 13a and 13b are layers not sintered even in the third step and has a main component of oxide in which the inorganic powder is included in the laminated body 12.
申请公布号 JP2002094245(A) 申请公布日期 2002.03.29
申请号 JP20000285536 申请日期 2000.09.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAITO RYUICHI;KAGATA HIROSHI;KAWAKITA KOJI;KATSUMURA HIDENORI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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