发明名称 |
METHOD FOR MANUFACTURING MULTI-LAYER BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flat multi-layer board easily. SOLUTION: The method for manufacturing a flat multi-layer board includes: a first step of forming a laminated body 12 containing ceramic powder and glass powder and an electric wiring 1 formed therein; a second step of forming layers 13a and 13b containing inorganic powder and resin on one main plane 12a and the other main planes 12b of the laminated body 12; and a third step of burning the laminated body 12 having the layers 13a and 13b to form a base body 14 made of a dielectric body of a sintered body. The layers 13a and 13b are layers not sintered even in the third step and has a main component of oxide in which the inorganic powder is included in the laminated body 12. |
申请公布号 |
JP2002094245(A) |
申请公布日期 |
2002.03.29 |
申请号 |
JP20000285536 |
申请日期 |
2000.09.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAITO RYUICHI;KAGATA HIROSHI;KAWAKITA KOJI;KATSUMURA HIDENORI |
分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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