发明名称 BOND SETTLEMENT MANAGING SYSTEM AND ITS METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bond settlement managing system capable of managing steps in a settlement processing. SOLUTION: This bond settlement managing system 10 executes a settlement processing comprising a plurality of steps for executing predetermined processing contents and manages the processing. The system 10 has a settlement processing means 11 for transferring steps of the settlement processing based on a scenario DB 12 storing as a scenario a transition condition from each step to its next step in the settlement processing, a trade managing DB 14 for storing status information indicating a present step in the settlement processing, the status information stored in the trade managing DB 14, and the scenario stored in the scenario DB 14.
申请公布号 JP2002092331(A) 申请公布日期 2002.03.29
申请号 JP20000283762 申请日期 2000.09.19
申请人 INFORMATION SERVICES INTERNATIONAL DENTSU LTD 发明人 IIDA TETSUO;HIGA YASUO
分类号 G06Q30/04;G06Q30/06;G06Q40/00;G06Q40/02;G06Q40/04;G06Q50/00 主分类号 G06Q30/04
代理机构 代理人
主权项
地址