| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive film type flip-chip bonding structure where of low cost, and there is no restriction on its usable semiconductor chip, and its each bump and its each electrode can be connected with high reliability and surely by a low connective resistance. SOLUTION: In the flip-chip bonding structure, on each circuit-board electrode 21 of a circuit board 2, each leveled solder bump 22b is formed to connect each solder bump 22b and each semiconductor-chip electrode 11 of a semiconductor chip 1 by an anisotropic conductive film 3. Each leveled solder bump 22b is formed to be molded with a leveling member the upper portion of each solder layer through plating, etc. This solder bump 22b is formed readily, and variations in the space between each semiconductor-chip electrode 11 and it is reduced, and its effective opposite area to each semiconductor-chip electrode 11 is enlarged, to increase the number of conductive particles 31 interposed between both.
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