METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND CARRIER TAPE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component satisfactorily and stably by carrying out a process for coating a chip with conductor paste for side face electrode correctly. SOLUTION: Since a plurality of chips CH are inserted in such an orientation as the opposite faces thereof in the longitudinal direction are clamped by the inner faces of a holding hole 11b1 in the widthwise direction under such a state as the plurality of chips CH are broken away from each other and the faces of the chips CH on the opposite sides in the height direction are broken away from the inner faces of the holding hole 11b1 in the length direction and one side part of each chip CH in the widthwise direction is projected, a process for coating the chip CH with conductor paste for side face electrode is carried out correctly even if warp or deficient projection takes place when the chip CH is inserted into the holding hole 11b1 or a small size chip susceptible to warp or deficient projection is employed and an electronic component can be manufactured well and stably.