| 摘要 |
<p>PROBLEM TO BE SOLVED: To ensure attaching/detaching with less dust at delivery of a wafer by surely fixing the wafer, so that it will not be removed at handling in a violent gas flow. SOLUTION: At surface-processing of a wafer 10, while being placed on a process hand 46, the wafer 10 is grasped at multiple points, from the upper and lower surfaces using the process hand 46, where a surface processing target part is opened and a presser ring 100.</p> |
