发明名称 THERMAL CONDUCTING MATERIAL AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a thermal conducting material having high thermal conductivity which enables to manufacture and use favorably with its manufacture. SOLUTION: A thermal conducting material is obtained by mixing unvulcanized EPDM of an olefin based resin and paraffin of granular wax, to form a material to become a base material, and by mixing the base material with a thermal conducting filler to form. The thermal conducting material has the characteristic that it plasticizes and deforms elastically by liquefaction of its components, the unvulcanized EPDM and the paraffin, when received heat from an electronic part. As a result, adhesion of the thermal conducting material to the electronic part and a heat sink and the thermal conduction effect improves. The load on the electronic part is dispersed and unbiased loading is ensured, because the thermal conducting material deforms according to the shape of the electronic part.
申请公布号 JP2002093970(A) 申请公布日期 2002.03.29
申请号 JP20000279943 申请日期 2000.09.14
申请人 KITAGAWA IND CO LTD 发明人 KAWAGUCHI YASUHIRO
分类号 C08J3/20;B29B7/90;C08K3/00;C08K7/06;C08L23/00;C08L91/06;C09K5/08;H01L23/373 主分类号 C08J3/20
代理机构 代理人
主权项
地址