| 摘要 |
PROBLEM TO BE SOLVED: To provide an upper electrode, and a dry etching system using it, having no possibility of being contaminated with impurities in which not only highly accurate parallelism is kept with respect to a lower electrode but also the etching characteristics are enhanced, and the yield of silicon wafer is increased through good thermal conduction between an electrode plate and a base. SOLUTION: In the upper electrode for a dry etching system comprising a silicon electrode plate and a base supporting it, (a) the base is composed of graphite, and (b) the silicon electrode plate and the base are bonded through organic adhesive containing a filler having Young's modulus of 6×109 to 68×109 N/m2.
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