发明名称 |
BATCH TYPE HEAT TREATMENT EQUIPMENT AND ITS CONTROL METHOD |
摘要 |
PROBLEM TO BE SOLVED: To estimate an accurate temperature for a heat treatment equipment by estimating the temperature of a substance to be treated in order to perform the heat treatment of the substance. SOLUTION: A reactive pipe 2 is provided with heaters 31-35, temperature sensors Sin1-Sin5 and Sout1-Sout5 and houses a wafer boat 23. A control part 100 estimates the temperatures of wafers W of five zones corresponding to the heaters 31-35 of the pipe 2 and also the temperatures of sensors Sin1-Sin5 by means of the electric power of the sensors Sin1-Sin5, Sout1-Sout5 and the heaters 31-35. The functions f1-f5 showing the relation between the estimated temperature and actual temperature of every zone are calculated from the relation of estimated and actual temperatures among sensors Sin1-Sin5. The estimated wafer temperatures are substituted for the functions f1-f5 for correcting the wafer temperatures. The electric power supplied to the heaters 31-35 are individually controlled so that the corrected wafer temperatures are converged on a target temperature track.
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申请公布号 |
JP2002091574(A) |
申请公布日期 |
2002.03.29 |
申请号 |
JP20000278526 |
申请日期 |
2000.09.13 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
O BUNRYO;SAKAMOTO KOICHI;SUZUKI FUJIO;YASUHARA MOYURU |
分类号 |
H01L21/324;C23C16/46;C23C16/52;C30B31/18;F27B5/18;F27D19/00;F27D21/00;G05D23/19;H01L21/00;H01L21/205;H01L21/22;(IPC1-7):G05D23/19 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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