发明名称 COOLING DEVICE OF ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide the cooling device of electronic equipment that can smoothly circulate cooling liquid, has excellent radiation efficiency, and can improve cooling capability. SOLUTION: A liquid-cooling mechanism has a heat reception surface in contact with the heat generation site of the electrical heating element for absorbing generated heat, and at the same time forms a liquid channel for circulating the cooling liquid in a body. The liquid channel comprises a heat-absorber cover for closing in a laminar shape via a gasket, and a water pump section for circulating the cooling liquid into the liquid channel by an impeller. The forced air-cooled mechanism comprises a fan driven by a motor, and a radiation fin formed in a body and a body housing. The arrangement position of the water pump section of the liquid-cooling mechanism is in flush with the mounting position of the liquid channel of the heat absorber.
申请公布号 JP2002094277(A) 申请公布日期 2002.03.29
申请号 JP20000318579 申请日期 2000.09.12
申请人 NIPPON THERMOSTAT CO LTD 发明人 MORI AKIRA;KUSAKABE FUMITO
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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