| 摘要 |
PROBLEM TO BE SOLVED: To provide a coil on-chip module having a structure comprising a coil formed on a semiconductor chip, easily designable for wiring and conformable also to a general IC such as ISO14443. SOLUTION: This coil on-chip module comprises a first insulating layer formed in a prescribed shape in the non-terminal area on the terminal surface of the semiconductor chip, a first wiring layer consisting of a coil wiring, which is provided thereon and, further as occasion demands, at least one coil wiring layer consisting of a coil wiring or the coil wiring and a connecting wiring, which is formed on the first wiring layer and the first insulating layer through insulating layers, respectively. Each insulating layer formed on the first wiring layer and the first insulating layer comprises a via part for mutually connect the wiring layers, which is formed by burying a conductive layer in the opening of the insulating layer to mutually electrically connect both the layers. The wiring of the uppermost wiring layer is electrically connected to the terminal of the semiconductor chip through a connecting wiring extending from the uppermost wiring layer to the terminal of the semiconductor chip. |
