WIRE SAW AND PROCESS FOR SLICING MULTIPLE SEMICONDUCTOR INGOTS

摘要

A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). The ingot support (12) is adapted for mounting at least two ingots (14) thereon in registration with the cutting web. A slurry delivery system includes nozzles (34, 36, and 38) in an amount of at least one more than the number of ingots, the nozzles being positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.