Method for carrying out planarization processing

摘要

There is provided a planarization process wherein a workpiece is polished uniformly. When planarizing a surface to be processed of a workpiece by polishing the surface with a polishing pad, planarization is carried out by (a) disposing the polishing pad above the surface to be processed, so that a part of the surface to be processed is exposed out of the shadow of the polishing pad; (b) contacting the surface with the polishing pad so as to generate a pressure therebetween; and (c) oscillating the polishing pad while rotating the workpiece around its center axis as a rotation axis so as to polish the surface, respectively at two or more different positions on the surface to be processed, wherein the residence time of the polishing pad at each position is changed so as to make a processed amount of the surface at each position desired.