发明名称 PINHOLE DEFECT REPAIR BY RESIST FLOW
摘要 According to one aspect of the present invention, pinhole defects in resist coatings are repaired by heating the resist briefly to induce the resist to flow and fill pinholes. The resist is brought to a temperature at or above that at which the resist flows for long enough to permit the resist to flow and fill pinhole defects, but not so long as to corrupt the resist pattern. The original resist pattern may be biased to allow for some flow during the pinhole repair process. The entire patterned resist may be heated at once, or it may be heated one portion at a time. The application of heat may optionally be limited to locations where pinhole defects are found. By means of the invention, very thin patterned resist coatings free from pinhole defects may be obtained.
申请公布号 WO0225375(A2) 申请公布日期 2002.03.28
申请号 WO2001US29565 申请日期 2001.09.21
申请人 ADVANCED MICRO DEVICES, INC. 发明人 TEMPLETON, MICHAEL, K.
分类号 G01Q30/10;G03F7/40;H01L21/027;H01L21/66 主分类号 G01Q30/10
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