Coating substrate surface with metal or alloy using electrolyte solution, e.g. for galvanizing wafer, involves applying stabilizer to substrate surface to maintain metal or alloy in electrolyte solution

摘要

Process for coating a surface of a substrate with a metal or an alloy using an electrolyte solution comprises applying a stabilizing agent on the substrate surface to maintain the metal or metal alloy in the electrolyte solution. An Independent claim is also included for an electrolyte solution used in the process comprising 0.5-1.0 mol/kg citrate, 0.5 mol/kg acetate, 0.2-0.5 mol/kg EDTA and 0.1-1.0 mol/kg ammonia. Preferred Features: The stabilizing agent is directly applied to the wet wafer surface using an electrochemical or currentless coating process.