发明名称 TOOL OFFSET METHOD AND APPARATUS OF WIRE BONDER
摘要 PURPOSE: A tool offset method and an apparatus of a wire bonder are provided to obtain automatically tool offset by using a prism unit having a '+' shaped mark. CONSTITUTION: A tool offset apparatus is provided with a vision pattern recognition system(10), a bond head(21), a worktable(23), a prism unit(20), and a central processing unit(30). The vision pattern recognition system(10) includes a camera(14) having a lens tube(15), and a monitor(11) for displaying a recognized image from the camera(14) onto a screen(12). The bond head(21) is installed with the camera(14) and a tool(22). The worktable(23) fixes a work object under the camera(14) and the tool(22). The central processing unit(30) analyzes the recognized image from the camera(14) and controls the bond head(21). The prism unit(20) is composed of a prism(25), and a fixing table(24). The prism(25) has a '+' shaped mark(26) on a partial portion of the prism(25). The prism(25) is fixed on the fixing table(24).
申请公布号 KR100332128(B1) 申请公布日期 2002.03.28
申请号 KR19950039314 申请日期 1995.11.02
申请人 HYNIX SEMICONDUCTOR INC. 发明人 MUN, YEONG GYU
分类号 H01L21/60 主分类号 H01L21/60
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