发明名称 MOLD COOLING DEVICE
摘要 <p>A mold cooling device comprising an air feeding/discharging circuit (22) for effecting the pneumatic drive of a pump section (1) which feeds cooling liquid to a fluid flow passageway (65a) formed in a mold (64), and the feeding of air to the fluid flow passageway (65a). Let Dx be the outer diameter-equivalent dimension of the perforated raised portion (53x) of a cast article (64x), D1 be the outer diameter of the pin portion (65) of the mold (64), t1 be the outer peripheral wall-thickness of the pin portion (65), and T1 be -5.103+(0.621 Dx)-(1.068 D1)+(3.61 t1). Then the time T required for feeding the cooling liquid to the fluid flow passageway (65a) after completion of the flowing of molten metal into the mold (64) is set to satisfy the relation T1 -0.5 sec. ≤ T ≤ T1 +0.5 sec. Further, the central region of the bottom surface (67) in a bottomed cooling hole (66) formed in the mold (64) is formed with a flat surface portion (67a) which the front end open portion of an inner pipe (62) approaches in opposed relationship thereto. The outer peripheral region thereof is formed with a curved surface portion (67b) continuously extending from the flat surface portion (67a) to the inner peripheral surface (66a) of the bottomed cooling hole (66).</p>
申请公布号 WO2002024376(P1) 申请公布日期 2002.03.28
申请号 JP2001008082 申请日期 2001.09.17
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