发明名称 APPARATUS FOR SUPPORTING HIGH-ACCURACY LAYERED ELECTRONIC DEVICES
摘要 PURPOSE: An apparatus for supporting high-accuracy layered electronic devices is provided to reduce the manufacturing cost by employing the structure of a reinforcing plate for supporting an overlapped state of an elastic member and a metal support plate. CONSTITUTION: An elastic member(110) for supporting devices is provided with a plurality of device supporting grooves for inserting and supporting electronic devices, elastically. A metal supporting plate(120) is provided with a plurality of opening grooves(122) corresponding to the device supporting grooves of the elastic member(110). The metal supporting plate(120) is formed on at least one of upper and lower surfaces of the elastic member(110). A reinforcing plate(130) maintains the layered state of the elastic member(110) and the metal supporting plate(120).
申请公布号 KR20020023385(A) 申请公布日期 2002.03.28
申请号 KR20020003494 申请日期 2002.01.22
申请人 HIRUTA, KENGO 发明人 HIRUTA, KENGO
分类号 H05K13/00;H05K13/04;(IPC1-7):H05K1/02 主分类号 H05K13/00
代理机构 代理人
主权项
地址