| 摘要 |
<p>Method for installing a chip comprising a plurality of contacts in a predetermined layout at one side of the chip on a substrate comprising amongst others a plurality of contacts in a further layout which is the mirror of said predetermined layout, said method comprising the following steps a) attaching a predetermined amount of solder (called solderball) at each contact on the chip, b) applying a predetermined amount of relatively soft, electrically insulating material on the substrate, c) positioning the chip opposite the substrate at some distance thereof, such that the contact bearing side of the chip is oriented towards the contact bearing surface section of the substrate and each contact on the chip is aligned with the corresponding contact on the substrate, d) reducing the distance between chip and substrate until the solder carrying contacts are pressing against the corresponding contacts on the substrate, e) heating at least part of the resulting sub assembly such that the solder will become fluent and causes the corresponding contacts on chip and substrate to become connected, wherein f) the amount of insulating material is sufficient to provide a mechanical connection between chip and substrate and small enough to avoid interference between this insulating material and the various solderballs.</p> |
