| 摘要 |
<p>A developing solution for photoresists which, when applied to a photoresist which has been exposed, highly wets the insoluble parts of the resist, highly dissolves the soluble parts therein, and is effective in reducing the rate of dissolution of the insoluble parts. The developing solution is prepared by incorporating a nonionic surfactant and a cationic surfactant into an aqueous alkali solution in a concentration of 10 to 5,000 ppm by weight.</p> |
