FLUX APPLYING METHOD, FLOW SOLDERING METHOD AND DEVICES THEREFOR AND ELECTRONIC CIRCUIT BOARD

摘要

A spraying flux applying method in a flow soldering process for mounting electronic components on a board (1) by using soldering materials, wherein soldering materials are sufficiently supplied to through holes formed in the board (1). A spraying flux applying method which sprays flux (3) containing solvent and active components toward the board (1) from a nozzle (6) to coat the board (1) with flux (3), the sprayed flux (3) kept in a substantially liquid state being stuck to the board (1). More specifically, the distance between the nozzle (6) for spraying flux (3) toward the board (1) and the board (1) positioned above the nozzle (6) is set to about 30-60 mm.