发明名称 |
ELECTROLYTE AND METHOD FOR DEPOSITING TIN-COPPER ALLOY LAYERS |
摘要 |
The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic sulfur compounds having one or more thioether functions and/or ether functions of general formula -R-Z-R'- (R and R' are the same or different non-aromatic organic radicals, and Z represents S or O). The invention also relates to a method, which involves the use of the electrolyte, to the coating obtained using said method, and to the use of the electrolyte for coating electronic components. |
申请公布号 |
WO0224979(A1) |
申请公布日期 |
2002.03.28 |
申请号 |
WO2001EP10907 |
申请日期 |
2001.09.20 |
申请人 |
DR.-ING. MAX SCHLOETTER GMBH & CO. KG;DIETTERLE, MICHAEL;JORDAN, MANFRED;STRUBE, GERNOT |
发明人 |
DIETTERLE, MICHAEL;JORDAN, MANFRED;STRUBE, GERNOT |
分类号 |
C25D3/58;C25D3/60;H05K3/24 |
主分类号 |
C25D3/58 |
代理机构 |
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