发明名称 |
PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
A photosensitive element having a support film and a photosensitive resin layer formed on the support film. The support film is a multilayer support film composed of at least three layers. The photosensitive resin layer is made of a photosensitive resin composition containing (A) a binder polymer, (B) photopolymerizable compound having at least one polymerizable ethylenic unsaturated group in a molecule, and (C) a photopolymerization initiator. A method for forming a resist pattern characterized in that such a photosensitive element is so placed on a circuit-forming board that the photosensitive resin layer is in contact with the circuit-forming board, an exposure area is formed by irradiating a predetermined portion of the photosensitive resin layer with activating light, and the portion other than the exposure area is removed and a method for manufacturing a printed wiring board characterized in that a circuit-forming board on which a resist pattern is formed by such a resist pattern forming method is etched or plated are also disclosed.
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申请公布号 |
WO0225377(A1) |
申请公布日期 |
2002.03.28 |
申请号 |
WO2001JP08192 |
申请日期 |
2001.09.20 |
申请人 |
HITACHI CHEMICAL CO., LTD.;AOKI, TOMOAKI;KAWAGUCHI, TAKU;ICHIKAWA, TATSUYA |
发明人 |
AOKI, TOMOAKI;KAWAGUCHI, TAKU;ICHIKAWA, TATSUYA |
分类号 |
B32B27/06;B32B27/08;G03F7/027;G03F7/028;G03F7/09;(IPC1-7):G03F7/004;B32B27/36 |
主分类号 |
B32B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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