发明名称 ELECTROSTATIC CHUCK FOR FIXING WAFER
摘要 PURPOSE: An electrostatic chuck for fixing a wafer is provided to increase attraction force for fixing the electrostatic chuck, by forming oxide silicon made of a dielectric so that the dielectric having a high dielectric constant and a thin thickness can be fabricated. CONSTITUTION: A cathode pole is a circular type. An anode pole(52) of a doughnut type is disposed outside the circular cathode pole(50). A cathode pole(54) of a doughnut type is disposed outside the doughnut-type anode pole. The first oxide layer is grown on the circular cathode pole, the doughnut-type anode pole and the doughnut-type cathode pole, in a gap where the poles are separated, and under the doughnut-type anode pole, by a thermal oxidation. The second oxide layer is formed in a base(40) made of an aluminum material by an anodizing process. A groove where the poles are inserted is formed in the base. A voltage supply unit(30) passes through a hole penetrating the base and is connected to the doughnut-type anode pole by an interconnection. The voltage supply unit supplies a constant voltage for generating electrostatic force, connected to the base by another interconnection.
申请公布号 KR20020022345(A) 申请公布日期 2002.03.27
申请号 KR20000055086 申请日期 2000.09.20
申请人 KIRIM SEMITEC 发明人 LEE, JEONG GI
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
代理机构 代理人
主权项
地址