发明名称 Insulated gate semiconductor device
摘要 <p>An insulated gate semiconductor device comprises: a semiconductor substrate having a first semiconductor region (11) on one surface, a second semiconductor region (12) of a second conductivity type v adjacent to said first semiconductor region on the other surface, a plurality of third semiconductor regions (13) of the first conductivity type extending into said second semiconductor region, two fourth (14) semiconductor regions, of the second conductivity type, extending into each of said third semiconductor regions, and a plurality of insulating gates (21, 22, 31) formed on the other of the pair of main surfaces, wherein a length (B) of each of said insulating gates, from one side to another opposed side of each insulating gate, is longer than a distance (A) between adjacent sides of adjacent insulating gates. <IMAGE></p>
申请公布号 EP1191600(A2) 申请公布日期 2002.03.27
申请号 EP20010125303 申请日期 1988.08.22
申请人 HITACHI, LTD. 发明人 MORI, MUTSUHIRO;TANAKA, TOMOYUKI;YASUDA, YASUMICHI;NAKANO, YASUNORI
分类号 H01L29/68;H01L21/225;H01L21/331;H01L21/336;H01L29/739;H01L29/78;(IPC1-7):H01L29/739 主分类号 H01L29/68
代理机构 代理人
主权项
地址