METHOD FOR PRODUCING ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for producing an adhesive film for semiconductors by a ready process and a semiconductor device using this method. SOLUTION: This method for producing an adhesive film for semiconductors comprises (1) a step for preparing a monolayer adhesive film by forming a layer of a thermoplastic adhesive agent having 0.1-10 MPa storage elastic modulus at 180 deg.C and -80 to 50 deg.C peak temperature of loss modulus on a substrate and (2) a step for superposing an adhesive layer surfaces of the above adhesive film to both sides of a heat-resistant film and pressing the adhesive layer surfaces at a temperature higher by 50-200 deg.C than the peak temperature of loss modulus of the thermoplastic adhesive agent. This semiconductor device is obtained by using the above film.