发明名称 THERMALLY CONDUCTIVE POLYMERIC COMPOSITION AND THERMALLY CONDUCTIVE MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive polymeric composition which has excellent thermal conductivity and is suitable for heat-dissipating members, heat transfer members or materials for constituting them in electronic equipment and the like, and a thermal conduction molded product. SOLUTION: The graphitized carbon fiber to be incorporated into a thermally conductive polymeric composition has a spacing (d002) of graphite layers, measured by the X-ray diffraction method, of <0.3370 nm and, at the same time, a peak intensity ratio (P101/P100) of the (101) diffraction peak (101) to the (100) diffraction peak of >=1.15. This graphitized carbon fiber can be obtained by conducting each treatment of spinning with the use of a mesophase pitch as the raw material, rendering the resulting fiber infusible, and carbonization in the order named, then effecting pulverization and subsequent graphitization, and has a fiber diameter of 5-20μm and an average particle diameter of 5-500μm. The thermally conductive polymeric molded product can be obtained by molding the thermally conductive polymeric composition into a specified shape.
申请公布号 JP2002088256(A) 申请公布日期 2002.03.27
申请号 JP20000281702 申请日期 2000.09.18
申请人 POLYMATECH CO LTD 发明人 HIDA MASAYUKI
分类号 C08J5/00;C08K7/06;C08L101/00;C09K5/08;D01F9/145;H01L23/373 主分类号 C08J5/00
代理机构 代理人
主权项
地址