| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chamber type sputtering apparatus capable of improving its productivity by shortening the carrying time when a base board is carried in and carried out of a vacuum chamber. SOLUTION: This sputtering apparatus comprises a vacuum chamber device 41 having one load lock chamber 30 and more then one process chambers 31-35, and a carrying mechanism 20 for carrying the base board in order to deliver the base board to the load lock chamber. The carrying mechanism 20 comprises at least three loaders 21-23 capable of holding the base board in an attachable/ detachable manner and a rotating unit 24 for rotating the loaders, and the sputtering film-deposited base board can be taken out of another loader substantially simultaneously with the fitting of the base board before the sputtering film is deposition to the loader.
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