| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which exhibits a good reflow crack resistance even in high-temperature reflow at 260 deg.C or higher and is excellent in curability and thermal shock resistance; and an electronic part having an element sealed therewith. SOLUTION: This molding material essentially comprises (A) an epoxy resin, (B) a curing agent, (C) a cure accelerator, (D) an inorganic filler, and (E) rubber particles comprising a polymer formed from (a) an organosiloxane, (b) an optionally substituted alkyl acrylate, and (c) a vinyl compound. The electronic part has an element sealed with the material.
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