| 摘要 |
A semiconductor device in which a plurality of semiconductor chips (1) are consolidated into one and which is provided with at least a set of rerouting wiring lines (5) formed so as to interconnect electrodes (3) of the respective semiconductor chips (1), the electrodes having a function which is common to the respective semiconductor chips. The set of rerouting wiring lines (5) have a common external connection terminal (8). In this way the device requires fewer external terminals (8) than the total number of electrodes (3) on all of the semiconductor chips (1). <IMAGE> |
