发明名称 STRUCTURE OF MOTION SENSOR AND INTERNAL CONNECTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electrode connecting structure and connecting method for a sensor vibration body inside a motion sensor, suitable for connecting the plate-shaped sensor vibration body, being rationally manufactured, reducing the cost, enhancing the durability, making the size small, preventing application of strong force to the sensor vibration body, and suitable for a vessel for SMD packaging. SOLUTION: This motion sensor contains an internal electrode accommodating for the outside of the vessel and the sensor vibration body supported inside the vessel, and each internal electrode is connected to each electrode film on the surface of the sensor vibration body with a small, block-shaped conductive chip. The internal electrode surface and the electrode film surface, on which the conductive chip is placed, are made flush with each other. The constitution of a disk-shaped acceleration sensor is presented as an example of suitable structure. Internal connection method for placing and brazing the conductive chip with a multipurpose packaging machine is presented.
申请公布号 JP2002090384(A) 申请公布日期 2002.03.27
申请号 JP20000318566 申请日期 2000.09.13
申请人 MICROSTONE CORP 发明人 OKADA YOSHIYA
分类号 G01C19/56;G01C19/5628;G01P15/08;G01P15/09;G01P15/18;H01L41/08 主分类号 G01C19/56
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