LASER CUTTING METHOD, LASER CUTTING APPARATUS, AND METHOD AND APPARATUS FOR MANUFACTURING LIQUID CRYSTAL DEVICE

摘要

PURPOSE: A laser cutting method, a laser cutting apparatus, and a method and an apparatus for manufacturing a liquid crystal device are provided to precisely cut two substrates bonded to each other. CONSTITUTION: Scribe lines are formed in advance at cutting locations on both surfaces of a panel(26) formed by bonding an upper substrate and a lower substrate to each other via a sealing material. A laser beam is applied to each of the scribe lines on both surfaces. Thereby, a liquid crystal panel having a product size is obtained.