发明名称 Interconnect structure
摘要 <p>An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise. <IMAGE></p>
申请公布号 EP1191635(A2) 申请公布日期 2002.03.27
申请号 EP20010122202 申请日期 2001.09.17
申请人 NISSAN MOTOR CO., LTD. 发明人 MURAKAMI, YOSHINORI
分类号 H05K1/14;H01R12/52;H05K1/00;H05K1/02;H05K1/16;H05K3/36;H05K7/14;(IPC1-7):H01R12/04 主分类号 H05K1/14
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