| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition developable with a dilute aqueous alkali solution after exposure with UV, ensuring a wide range of what is called a heat management width which is the management of the thermally allowable limit of curing degree at which an unexposed part can be removed in development when a coating film is dried, having high sensitivity, excellent in heat resistance, electric insulating property and chemical resistance, suitable for a soldering resist film for a printed wiring board and having a long pot life and to provide a printed wiring board with a cured coating film of the composition. SOLUTION: The photosensitive resin composition contains (A) an active energy beam-curable resin having at least two ethylenically unsaturated bonds in one molecule, (B) at least one of an organic acid salt of dicyandiamide and its derivative, (C) a photopolymerization initiator, (D) a reactive diluent and (E) an epoxy type thermosetting compound. The printed wiring board uses the composition. |
