发明名称 ADHESION METHOD, METHOD FOR PRODUCING CARD BODY, AND FILM MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an adhesion method which can miniaturize a lamination apparatus. SOLUTION: In the adhesion method for bonding a first sheet (1a) and a second sheet (2a) together, a preparation process for preparing the first sheet (1a) and the second sheet (2a) in which a hot melt adhesive is applied on one surface and an adhesion process in which the first sheet (1a) and the second sheet (2a) are bonded together by heating the hot melt adhesive in a molten state while the first sheet (1a) and the second sheet (2a) which are laid to overlap each other are pressed are provided.
申请公布号 JP2002086571(A) 申请公布日期 2002.03.26
申请号 JP20010193842 申请日期 2001.06.27
申请人 AATEKU KANSAI KK 发明人 MIZUSHIMA TAMIKAZU
分类号 B42D15/02;B29C65/40;B29C65/78;B29L9/00;B32B7/12;B42D15/04;C09J5/00;C09J201/00;(IPC1-7):B29C65/40 主分类号 B42D15/02
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