METHOD FOR CONNECTING AND FIXING TERMINAL PLATE TO ELECTRODE PATTERN OF SUBSTRATE BY MOLDING RESIN AND ELECTRIC PART WITH TERMINAL PLATE

摘要

PROBLEM TO BE SOLVED: To provide a method for connecting a terminal plate to the electrode pattern of a substrate by a molding resin so as not to generate the connection defectiveness between the electrode pattern and the terminal plate even if the molding resin is molded around the electrode pattern even in such a state that only the terminal plate is brought into contact with the electrode pattern of the substrate. SOLUTION: A substrate 20 is housed in molds E1, E2 in such a state the terminal plate 40 is brought into contact with the electrode pattern of the substrate 20 and the molten molding resin is injected in the cavity C provided to the periphery of the electrode pattern, with which the terminal plate 40 comes into contact, of the molds E1 and E2 to be solidified and, thereafter the molds E1 and E2 are detached. The pin gate E21 of the molds E1 and E2 is positioned on the back surface side of the terminal plate 40 coming into contact with the substrate 20.