发明名称 |
Method of polishing a semiconductor wafer |
摘要 |
A modified process for chemical/mechanical polishing semiconductor wafers is provided. The process includes polishing a surface of the wafer, contacting the polished surface of the wafer with a surfactant, and drying the surface of the disengaged wafer for a sufficient period of time before contacting the surface of the wafer with a rinse media or subsequent process liquid. The process reduces defects, including etching stains, on the polished surface of the wafer.
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申请公布号 |
US6361407(B1) |
申请公布日期 |
2002.03.26 |
申请号 |
US20000631089 |
申请日期 |
2000.08.02 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
LU YONGQIANG;FRANK KENNETH;EDWARDS KEVIN |
分类号 |
C11D11/00;C11D17/04;H01L21/306;(IPC1-7):B24B1/00 |
主分类号 |
C11D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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