发明名称 |
Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed |
摘要 |
A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel-boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel-phosphorous or palladium. The nickel-phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.
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申请公布号 |
US6362089(B1) |
申请公布日期 |
2002.03.26 |
申请号 |
US19990294060 |
申请日期 |
1999.04.19 |
申请人 |
MOTOROLA, INC. |
发明人 |
MOLLA JAYNAL ABEDIN;FAY OWEN RICHARD |
分类号 |
H01L21/288;H01L21/60;H01L23/485;(IPC1-7):H01L21/44;B05D3/04;B05D3/10;B05D5/12 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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