发明名称 |
Dielectric films from organohydridosiloxane resins with high organic content |
摘要 |
A method of making a dielectric film on a substrate from a composition containing an organohydridosiloxane resin is presented. The organohydridosiloxane resins have a cage conformation and 40 mole percent or greater of an organic substituent. The process of making a dielectric film includes forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film. The dielectric films of the present invention exhibit dielectric constants of approximately 2.8 or lower.
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申请公布号 |
US6361820(B1) |
申请公布日期 |
2002.03.26 |
申请号 |
US20000609499 |
申请日期 |
2000.06.30 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
HACKER NIGEL P.;LEFFERTS SCOTT P.;FIGGE LISA K.;SLESSOR MICHAEL D. |
分类号 |
H01L21/312;(IPC1-7):B05D3/02;B05D5/12 |
主分类号 |
H01L21/312 |
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