发明名称 Electronic components cooling apparatus
摘要 An electronic component cooling apparatus includes an air-cooled or water-cooled heat radiating portion and a meandering capillary tube heat pipe which carry out heat transfer between a board having electronic components mounted thereon and the heat radiating portion. The heat radiating portion comprises a plate fin type radiator 21 with an outer-shape of a substantially flat plate. The meandering capillary tube heat pipe is a plate type heat pipe 13 with an outer-shape of a substantially flat plate. The meandering capillary 13c is connected along a surface of the heat radiating portion. Since the meandering capillary tube heat pipe has a very large heat transfer capacity and is able to transfer heat over a long distance with low thermal resistance, it is possible to separate the board apart from the heat radiating portion. Accordingly, flexibility in arrangement of the electronic components or the heat radiating portion is so improved that various shaped apparatus can be designed and manufactured.
申请公布号 US6360813(B1) 申请公布日期 2002.03.26
申请号 US20000574484 申请日期 2000.05.19
申请人 TS HEATRONICS CO., LTD. 发明人 KATOH TAKAHIRO;AMAKO KIYOO
分类号 H01L23/36;F28D15/02;H05K7/20;(IPC1-7):F28D15/00 主分类号 H01L23/36
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