发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad having good slurry holding characteristics, capable of performing a uniform polishing operation, and excellent in the resistance against chemicals. SOLUTION: The polishing pad consists of a porous body with open cells formed from polyimide resin, wherein it is preferable that the open-cell porous body does not have any dense layer at the surface obtained by the wet type solidification method.
申请公布号 JP2002086343(A) 申请公布日期 2002.03.26
申请号 JP20000274268 申请日期 2000.09.11
申请人 NITTO DENKO CORP 发明人 KAWASHIMA TOSHIYUKI;TABATA HARUO;SASAKI KIMIMITSU;IKEDA KENICHI;SHINTANI TAKUJI;TAWARA SHINJI
分类号 B24B37/20;B24B37/24;C08J9/28;H01L21/304 主分类号 B24B37/20
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