| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy and an electronic member having a solder ball and a solder bump having improved fatigue resistance and excellent impact resistance. SOLUTION: This solder alloy used for a solder bump and solder ball or an electronic member has a composition containing, by mass, 55 to 70% Sn, 0.5 to 5.0% Ag, 0.1 to 3.0% Sb, 0.1 to 3.0% Bi, 0.01 to 0.1% Cu and the balance Pb with inevitable impurities. The total content of Ag, Sb, Bi and Cu is <=5.0%. Further, one or more metals selected from the group consisting of Fe, Ni, Zn, In, Pt and Pd are contained by 0.01 to 0.5%. Moreover, 0.0005 to 0.005% P is contained. The electronic member has a solder bump and a solder electrode formed of the same solder alloy.
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