| 摘要 |
PROBLEM TO BE SOLVED: To eliminate dispersion of adhesive layers when a work in the form of thin plate is adhered to a polishing jig in a single-surface polishing process. SOLUTION: This adhering device includes a stay 13 and a hold-down plate 3 having a resilient piece 1 to pressurize a work 5 placed on the surface of polishing jig 6 through adhesives 4 from the side facing the adhesives 4 and from the surface on the opposite side, wherein the resilient piece 1 has resilience wholly or partially, and that portion of piece 1 having resilience is able to form a convex surface protruding toward the adhesives 5. |
