发明名称 THIN-BLADE GRINDING WHEEL PRODUCED BY ELECTROFORMATION
摘要 PROBLEM TO BE SOLVED: To provide a thin-blade grinding wheel produced by electroformation whereby chipping of a work to be ground and the grinding resistance are reduced. SOLUTION: The body 1 of a grinding wheel is configured so that super- abrasive grains 4 of diamond, cBN, etc., and a filler 5 consisting of SiC, h-BN, and/or ceramics having a lower hardness and finer particle size than other abrasive grains are arranged dispersedly in a metal-bound phase 3 consisting of Ni, Co, and/or alloy thereof, wherein Young's modulus of the body of grinding wheel should lie within the range of 0.5-1.85×1011 N/m2.
申请公布号 JP2002086360(A) 申请公布日期 2002.03.26
申请号 JP20000275574 申请日期 2000.09.11
申请人 MITSUBISHI MATERIALS CORP 发明人 HOSHI JUNJI;IKEDA YOSHITAKA;TORISAKA MASANORI
分类号 B24D3/06;B24D3/00;B24D3/02;(IPC1-7):B24D3/06 主分类号 B24D3/06
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