| 摘要 |
PROBLEM TO BE SOLVED: To provide a method in which the electrical characteristics of semiconductor packages having different thicknesses is measured, and to provide a test handler for the method. SOLUTION: A plurality of solar balls (4) as electrodes of a package (1) attached and bonded to the bottom face of the handler arm (9) of the test handler are brought into contact with a plurality of spring probes (10) as contactors of the test handler. A pressure force is loaded between them. The solder balls and the spring probes are electrically connected. The pressure force applied to the package (1) is measured by a pressure sensor (14) attached to the handler arm (9), and the handler arm (9) is controlled, in such a way that the measured pressure force agrees with a proper pressure force value which has been set. While the pressure force is being controlled so as not to exceed the set pressure force value, the electrical characteristics of the package (1) are measured.
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