| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being simply mounted on a substrate with a bonding wire independently on the size of LSI. SOLUTION: A stacked semiconductor device incorporating two or more LSI chips and formed by wire bonding comprises at least a first LSI 1 and a second LSI 9 packaged on a substrate 2. A through hole is bored in the substrate 2, the first LSI chip 1 is mounted through the hole, the second LSI chip 9 is mounted on the ground side of the first LSI chip 1, and the ground sides of the first and second LSI are bonded each other. |
