| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of an electronic part for a reduced profile of an electronic circuit device under formation. SOLUTION: An electronic part in which an electrode is formed on both ends is mounted on a substrate on the surface of which a pair of conductive mounting parts are formed. Here, there are provided a process where a fitting hole is formed between the pair of conductive mounting parts which penetrate the substrate, a process where a heat-resistant tape is pasted on the rear surface of the substrate to form a bottom surface having adhesiveness at the fitting hole, a process where the electronic part is placed on the bottom surface of the fitting hole, a process where a solder paste is applied in the regions connecting the electrodes of the electronic part and the conductive mounting parts, a process where a metal plate is placed on the solder paste, a process where the metal plate is connected to the conductive mounting part and an electrode of the electronic part by reflow soldering, and a process where the heat-resistant tape is removed.
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