发明名称 |
Method for uniform polish microelectronic device |
摘要 |
A method for achieving a uniform planar surface by a chemical mechanical polish includes surrounding an active area or array to be polished with a border of the active material such that the border is wider than a single active area within the array and is preferably spaced from the outermost active area by the same distance as the distance between active areas within the array. |
申请公布号 |
AU8694101(A) |
申请公布日期 |
2002.03.22 |
申请号 |
AU20010086941 |
申请日期 |
2001.08.31 |
申请人 |
MOTOROLA, INC. |
发明人 |
RANA P. SINGH;PAUL A. INGERSOLL |
分类号 |
H01L21/76;B24B37/04;H01L21/00;H01L21/304;H01L21/3105;H01L21/762;H01L21/8238;H01L21/8239 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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