| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip packaging method and a chip package for preventing an excessive overflow of a mold resin. SOLUTION: A substrate 1 is mounted to a pedestal 25 of a chamber 28, and a plasma is generated in the chamber 28, thereby performing a plasma cleaning. A mask member 33 having an opening 34 is provided in an upside of the substrate 1. Only a chip 2 and an arrangement area of a pad provided in the substrate 1 are exposed to the opening 34. Accordingly, the plasma does not collide with the entire surface of the substrate 1, but collides with only the arrangement area of the pad to enhance wettability. In a resin overflow preventing area surrounding the arrangement area, a mold resin is not in excessive flux, so that its shape does not collapse. |
