摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device of a structure where the device is strong against shocks from the outside and stresses to work on a piezoelectric vibrating piece and a continuity between the sides of electrodes on a package base and the vibrating piece can be improved, and to provide a manufacturing method of the device. SOLUTION: A piezoelectric device, having a structure where a piezoelectric vibrating piece 11 is bonded to mounting electrodes 44 and 44 provided on a package base 42, is provided with the mounting electrodes 44 and 44, which are provided on the base 42 are led to a drive voltage via continuity parts 44b and at the same time, are mounted with the piezoelectric vibrating piece 11; conductive anchor members 41 and 41, which are arranged on the surfaces of the electrodes 44 and 44 and are formed of a material having high adhesion to the surfaces of these electrodes 44 and 44; and the piezoelectric vibrating piece 11 is bonded to the upper parts of these members 41 and 41 via silicon conductive bonding agents 15 and 15. |